Electric signal connecting device and probe assembly and probing device using the same
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United States of America Patent
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Mar 31, 2009
Grant Date -
Jul 24, 2008
app pub date -
Mar 21, 2008
filing date -
Mar 16, 2004
priority date (Note) -
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Abstract
The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.
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