Composite core circuit module system and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 31, 2009
Grant Date -
Aug 2, 2007
app pub date -
Feb 2, 2006
filing date -
Feb 2, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuit module is provided in which at least one secondary substrate and preferably two such secondary substrates are populated with integrated circuits (ICs). A rigid core substrate for the circuit module is comprised of a structural member and a connective member. In a preferred embodiment, the structural member is comprised of thermally conductive material while the connective member is comprised of conventional PWB material. The secondary substrate(s) are connected to the connective member with a variety of techniques and materials while, in a preferred embodiment, the connective member exhibits, in a preferred embodiment, traditional module contacts which provide an edge connector capability to allow the module to supplant traditional DIMMs.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully