Method of integrated circuit packaging
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United States of America Patent
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Apr 7, 2009
Grant Date -
Dec 13, 2007
app pub date -
Jun 7, 2006
filing date -
Jun 7, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.
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