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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• IBIDEN CO., LTD.

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hiramatsu, Yasuji	Ibi-gun, JP	98	1573

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: 7514648

Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board

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