Micro surface mount die package and method
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United States of America Patent
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Apr 7, 2009
Grant Date -
N/A
app pub date -
Aug 13, 2005
filing date -
Aug 13, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A micro surface mount die package is described that includes a die attach pad having a plurality of integrally formed risers. A bumped die is mounted on the die attach pad such that the risers are located to the side of the die and the contact bumps face away from the die attach pad. An encapsulant covers the active and side surfaces of the die while leaving the contact bumps exposed on the packaged semiconductor device. Methods for forming such packages and panels suitable for use in forming such packages are also described.
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