Systems and arrangements for interconnecting integrated circuit dies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 7, 2009
Grant Date -
Mar 6, 2008
app pub date -
Aug 31, 2006
filing date -
Aug 31, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit interconnection system is disclosed. The system can include a first integrated circuit die having a first electrode configuration and a second integrated die having the same or a substantially similar electrode configuration. The system can also include a multilayer flexible cable having a first side and a second side that has substantially parallel conductors running along the cable. At least a portion of one of the parallel conductors can be exposed on the first side and/or the second side, such that the first and second integrated circuit die can be connected to both the first side and the second side of the multilayer flexible cable. The cable can be folded to provide a dense interconnect for stacked memory configurations.
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