Release agents comprising hydrophobic, nanoscalar particles, and the use of these mold release agents
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United States of America Patent
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Apr 14, 2009
Grant Date -
Nov 17, 2005
app pub date -
Feb 3, 2003
filing date -
Mar 12, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to mold-release agents, in particular mold-release agents which can be used for demolding moldings from molding tools, and also to the use of these mold-release agents.The mold-release agents of the invention, which are preferably based on suspensions of nanostructured microparticles, have the advantage of being markedly more environmentally compatible than the known mold-release agents based on organic or organosilicon compounds, since they can remain on the surfaces of the moldings. The use of the mold-release agents of the invention is very simple, since advantage can be taken of existing equipment. An example of a usual method is to produce injection moldings by means of injection molds into which the material is injected. The mold-release agent of the invention is applied, e.g. by spray-application, to the injection mold prior to the actual injection-molding process.Depending on the setting of the molding parameters, the microparticles are impressed into the surfaces of the moldings and anchored, and therefore another favorable effect is that the surfaces of the injection molding can have self-cleaning properties.
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