Semiconductor light emitting devices including a luminescent conversion element
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United States of America Patent
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Apr 14, 2009
Grant Date -
Oct 6, 2005
app pub date -
Feb 10, 2005
filing date -
Mar 31, 2004
priority date (Note) -
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Abstract
Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
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