Intelligent binning for electrically repairable semiconductor chips
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United States of America Patent
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Apr 14, 2009
Grant Date -
Oct 18, 2007
app pub date -
Jun 20, 2007
filing date -
Aug 2, 1996
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Abstract
The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures are determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.
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