Process of manufacturing high frequency device packages
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United States of America Patent
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Apr 21, 2009
Grant Date -
Sep 11, 2003
app pub date -
Nov 1, 2002
filing date -
Feb 22, 2002
priority date (Note) -
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Abstract
A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a conductive material to form a center conductor for a coaxial via structure.
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