MEMS device with non-standard profile
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United States of America Patent
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Apr 21, 2009
Grant Date -
Feb 9, 2006
app pub date -
Aug 9, 2004
filing date -
Aug 9, 2004
priority date (Note) -
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Abstract
A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a non-standard thickness. As known by those in the art, a standard device wafer has a standard thickness when its outer diameter equals the wafer outer diameter. In illustrative embodiments, however, the non-standard thickness is smaller than the standard thickness. The method then forms structure on the non-standard device wafer.
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