Method and apparatus for peeling surface protective film
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United States of America Patent
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-
Apr 21, 2009
Grant Date -
Apr 19, 2007
app pub date -
Oct 5, 2006
filing date -
Oct 14, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the semiconductor wafer, and the whole surface protective film is heated by the heating block. Thus, the air bubbles existing between the semiconductor wafer and the surface protective film are expanded or swelled, and the adhesion between the semiconductor wafer and the surface protective film is weakened. After that, the surface protective film is peeled from the semiconductor wafer. As a result, a peel starting point can be appropriately formed and damage to the wafer can be prevented.
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