Dimensionally stabilized flexible circuit fabrication method and product
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 28, 2009
Grant Date -
N/A
app pub date -
May 9, 2005
filing date -
Apr 15, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of fabricating a flexible circuit interconnect comprising a conductive pattern on a flexible substrate comprising layers of different components having different coefficients of thermal expansion, including exposing the flexible substrate sequentially to different temperature regimes tending to differentially expand the flexible circuit components, dimensionally stabilizing the flexible substrate with an added stainless steel layer only during said exposing to different temperature regimes, and removing stainless steel of the added layer from the flexible circuit after exposing the flexible circuit.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully