Electronic component and a panel
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United States of America Patent
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Apr 28, 2009
Grant Date -
Jun 15, 2006
app pub date -
Jul 8, 2004
filing date -
Jul 28, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.
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