Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength

United States of America Patent

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Apr 28, 2009
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Jun 14, 2007
app pub date
Dec 14, 2005
filing date
Dec 14, 2005

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Abstract

In an embodiment, a substrate includes a thin film capacitor embedded within. In an embodiment, a plurality of adhesion holes extend through the thin film capacitor. These adhesion holes may improve the adhesion of the capacitor to other portions of the substrate.

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Patent Owner	Address
INTEL CORPORATION	2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Guzek, John	Chandler, US	15	487
Min, Yongki	Phoenix, US	44	310

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Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength

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United States of America Patent

11304649

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PATENT NO	7525140
APP PUB NO	20070132063A1
SERIAL NO	11304649
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 28, 2009	US,7525140,B2 US7525140B2	GRANTED PATENT AS SECOND PUBLICATION
June 14, 2007	US,20070132063,A1 US20070132063A1	FIRST PUBLISHED PATENT APPLICATION

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11304649

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