Conductor board and method for producing a conductor board
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United States of America Patent
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-
May 5, 2009
Grant Date -
Jun 8, 2006
app pub date -
Dec 2, 2005
filing date -
Sep 15, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.
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