Packaging method for circuit board

United States of America Patent

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May 19, 2009
Grant Date
Jan 4, 2007
app pub date
Jun 30, 2005
filing date
Jun 30, 2005

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Expired

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Abstract

A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.

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Patent Owner	Address
INTEL CORPORATION	2200 MISSION COLLEGE BLVD SANTA CLARA CA 95054

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Inventor Name	Address	# of filed Patents	Total Citations
Eskildsen, Steven R	Folsom , US	14	198
Foehringer, Richard B	El Dorado Hills , US	8	55
Meyers, John G	Sacramento , US	19	120
Snodgress, Jason E	Cameron Park , US	6	15

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Packaging method for circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11173219

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PATENT NO	7533457
APP PUB NO	20070004095A1
SERIAL NO	11173219
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 19, 2009	US,7533457,B2 US7533457B2	GRANTED PATENT AS SECOND PUBLICATION
January 04, 2007	US,20070004095,A1 US20070004095A1	FIRST PUBLISHED PATENT APPLICATION

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11173219

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