Methods for processing wafer surfaces using thin, high velocity fluid layer
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United States of America Patent
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May 19, 2009
Grant Date -
Sep 25, 2008
app pub date -
May 30, 2008
filing date -
Sep 30, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.
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