Method for circuits inspection and method of the same
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United States of America Patent
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May 19, 2009
Grant Date -
Aug 21, 2008
app pub date -
Feb 20, 2007
filing date -
Feb 20, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for circuit inspection comprises steps of providing a substrate having a conductive line; and forming a metal layer on at least the conductive layer to increase a contrast between the conductive layer and adjacent area for the circuit inspection. The method further comprising removing the metal layer. The metal layer is removed by a mixture of nitric acid, hydrogen peroxide and fluoride boric acid. The metal includes Silver, Nickel or Tin. The deposit metal can be removed by inter diffusion and form intermetallic compounds (for example Cu.sub.6Sn.sub.5) into the under laying conducting line.
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