Semiconductor device and method of manufacturing the same

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United States of America Patent

PATENT NO 7534709
APP PUB NO 20060014355A1





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Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming the semiconductor devices. A resistance reducing layer is formed between a polysilicon layer and a metal layer. As a result, an interface resistance between the polysilicon layer and the metal layer is greatly reduced and a distribution of the interface resistance is very uniform. As a result, a conductive structure including the resistance reducing layer has a greatly reduced sheet resistance to improve electrical characteristics of a semiconductor device having the conductive structure.

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Inventor Name Address # of filed Patents Total Citations
Choi, Gil-Heyun Gyeonggi-do, KR 214 3171
Lee, Byung-Hak Suwon-si, KR 33 170
Lee, Chang-Won Gyeonggi-do, KR 78 573
Lee, Jang-Hee Seoul, KR 41 206
Lim, Dong-Chan Seoul, KR 32 209
Park, Hee-Sook Seoul, KR 75 397
Park, Jae-Hwa Gyeonggi-do, KR 47 169
Sohn, Woong-Hee Gyeonggi-do, KR 40 212
Yoo, Jong-Ryeol Gyeonggi-do, KR 40 295
Yun, Sun-Pil Seoul, KR 1 7

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