Semiconductor component with semiconductor chip and adhesive film, and method for its production
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United States of America Patent
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May 19, 2009
Grant Date -
Aug 16, 2007
app pub date -
Oct 10, 2006
filing date -
Oct 10, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor component with a semiconductor chip and an adhesive film, and a method for its production is disclosed. In one embodiment, the semiconductor component has the adhesive film, which is internally prestressed and is adhesive on both faces, between the rear face of the semiconductor chip and a chip connecting surface on a circuit mount.
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