Semiconductor components having through interconnects
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United States of America Patent
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May 26, 2009
Grant Date -
Jul 3, 2008
app pub date -
Dec 28, 2006
filing date -
Dec 28, 2006
priority date (Note) -
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Abstract
A semiconductor component includes a semiconductor substrate having a substrate contact on a circuit side thereof in electrical communication with an integrated circuit, and a through interconnect in physical and electrical contact with the substrate contact configured to provide a signal path to a back side of the semiconductor substrate. The through interconnect includes an opening in the semiconductor substrate aligned with the substrate contact, and a projection on an interposer substrate (or alternately on a second semiconductor substrate) configured for mating physical engagement with the opening in the semiconductor substrate. The projection can also include a conductive via configured for electrical contact with a backside of the substrate contact and with a terminal contact for the component.
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