Three dimensional integrated circuits
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United States of America Patent
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May 26, 2009
Issued Date -
N/A
app pub date -
Apr 17, 2008
filing date -
Jul 8, 2002
priority date (Note) -
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Abstract
A three-dimensional semiconductor device, comprising: a programmable logic circuit; and a configuration circuit comprising a non planar memory element, wherein: a portion of the memory element is positioned above or below the logic circuit; and an output of the memory element is coupled to the logic circuit to program the logic circuit.
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