CMP pad conditioner
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United States of America Patent
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Jun 2, 2009
Grant Date -
Sep 20, 2007
app pub date -
Mar 7, 2007
filing date -
Mar 14, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to the flat part, and wherein abrasive grains having acute shapes are fixed to the inclined part.
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