Thin film forming apparatus
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United States of America Patent
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-
Jun 2, 2009
Grant Date -
Jul 7, 2005
app pub date -
Nov 12, 2004
filing date -
Nov 14, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
When a solution sprayed by a spray nozzle portion reaches one surface portion of a substrate, a thin film forming material contained the solution decomposes thermally because the substrate is heated to a prescribed temperature, and a thin film is formed on the one surface portion of the substrate. An imaging section obtains a prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, and a main control section controls a valve section based on the prescribed information from the imaging section. Since, based on the prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, the main control section allows the spraying nozzle portion to spray the solution therefrom, a thin film of the desired thickness can be formed with high accuracy.
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