Optimized mounting area circuit module system and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 2, 2009
Grant Date -
Mar 9, 2006
app pub date -
Oct 19, 2005
filing date -
Sep 3, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully