Encapsulated electrical component and production method
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United States of America Patent
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Jun 9, 2009
Grant Date -
Sep 27, 2007
app pub date -
Apr 21, 2005
filing date -
Apr 22, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.
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