Wafer dividing method and wafer dividing apparatus
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United States of America Patent
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Jun 9, 2009
Issued Date -
N/A
app pub date -
Jan 8, 2007
filing date -
Jan 13, 2006
priority date (Note) -
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Abstract
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.
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