Pattern reversal employing thick residual layers
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United States of America Patent
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Jun 16, 2009
Grant Date -
Mar 23, 2006
app pub date -
Sep 21, 2004
filing date -
Sep 21, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention features a method of patterning a substrate that includes forming, on the substrate, a first layer having a first pattern and selectively shifting in tone, as well as along a first direction, a subsequent pattern formed into the same layer that corresponds to the first pattern. To that end, one method of the present invention includes generating into the first layer, a second pattern having a shape inverse to the first pattern. A third pattern is then transferred into the first layer that has a shape inverse to the second pattern.
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