Method of forming a printhead
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United States of America Patent
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-
Jun 23, 2009
Grant Date -
Aug 16, 2007
app pub date -
Jul 27, 2006
filing date -
Oct 31, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A method of bonding two semiconductor substrates to form a printhead includes aligning a top surface of a first substrate with a second substrate, wherein the first substrate has a fluid channel in the top surface, heating the first and second substrates to a first temperature in a partial vacuum, and placing the top surface of the first substrate in contact with the second substrate to form a bond.
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