Elastomer bonding of large area sputtering target
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United States of America Patent
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Jun 23, 2009
Grant Date -
Nov 30, 2006
app pub date -
Sep 12, 2005
filing date -
May 31, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bonding at least one sputtering target tile to a backing plate comprises providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate, and providing at least one metal mesh within the elastomeric adhesive layer, wherein at least a portion of the at least one metal mesh contacts both the at least one sputtering target tile and the backing plate, and the at least a portion of the at least one metal mesh is made of metal wire with diameter greater than 0.5 mm.
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