Ball grid array package with separated stiffener layer
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United States of America Patent
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Jun 23, 2009
Grant Date -
Aug 7, 2003
app pub date -
Oct 31, 2002
filing date -
Feb 1, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
In a ball grid array (BGA) package, a first stiffener is attached to a surface of a substrate. A second stiffener is attached to the surface of the substrate to be co-planar with the first stiffener. The second stiffener is separated from the first stiffener by a channel therebetween. An integrated circuit (IC) die is mounted to a surface of the second stiffener.
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Cited Art Landscape
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