System and method for display device with integrated desiccant
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United States of America Patent
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Jun 23, 2009
Grant Date -
Apr 13, 2006
app pub date -
Apr 15, 2005
filing date -
Sep 27, 2004
priority date (Note) -
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Abstract
A package structure and method of packaging an interferometric modulator with an integrated desiccant. An interferometric modulator is formed on a transparent substrate. A backplane is joined to the transparent substrate to form a package structure and to encapsulate the interferometric modulator. A desiccant integrated into the backplane or the transparent substrate is provided to absorb moisture within the package.
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