Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7553390
APP PUB NO 20050056127A1
SERIAL NO

10494565

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for cutting apart a glass substrate is provided whereby scribing of the glass substrate is possible without being affected by the presence or thickness of a deposited film formed thereon and without scratching the deposited film. To treat a glass substrate having a deposited film, such as a thin film or resin film, formed on one surface thereof, there are provided a shaving device, which is a blade that removes strip-shaped portions of the deposited film to expose strip-shaped regions on the glass substrate, and a wheel cutter that forms scribed lines along the strip-shaped regions exposed on the glass substrate. The glass substrate is cut apart along the scribed lines.

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Patent Owner(s)

Patent OwnerAddress
CITIZEN SEIMITSU CO LTD6663-2 FUNATSU FUJIKAWAGUCHIKOMACHI MINAMITSURU-GUN YAMANASHI 401-0395

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furuya, Toshimitsu Yamanashi, JP 2 66
Horiuchi, Takane Yamanashi, JP 2 66
Izumi, Akinori Nara, JP 9 166
Kaida, Kazuya Nara, JP 12 204
Katayama, Tetsuro Fujiyoshida, JP 3 66
Komoda, Tomohisa Mie, JP 7 129
Takabe, Shinya Fujiyoshida, JP 2 66
Yamabuchi, Koji Nara, JP 23 278

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