Method of fabricating interferometric devices using lift-off processing techniques
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United States of America Patent
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Jun 30, 2009
Grant Date -
Mar 30, 2006
app pub date -
Jun 17, 2005
filing date -
Sep 27, 2004
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Abstract
Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.
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