Printed circuit board and soldering method and apparatus
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United States of America Patent
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-
Jun 30, 2009
Grant Date -
Feb 8, 2007
app pub date -
Jul 28, 2006
filing date -
Aug 5, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each through hole in which a component lead is inserted, whereby solder wicking up into the through hole is enhanced and air entrapment is prevented during the dip soldering operation, and heat fatigue resistance of solder joints is improved.
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