Semiconductor devices including porous insulators
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United States of America Patent
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Jun 30, 2009
Grant Date -
Feb 24, 2005
app pub date -
Sep 1, 2004
filing date -
Aug 29, 2002
priority date (Note) -
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Abstract
Semiconductor devices with porous insulative materials are disclosed. The porous insulative materials may include a consolidated material with voids dispersed therethrough. The voids may be defined by shells of microcapsules. The voids impart the dielectric materials with reduced dielectric constants and, thus, increased electrical insulation properties.
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