Microelectronic packages and methods therefor
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United States of America Patent
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Jun 30, 2009
Issued Date -
N/A
app pub date -
Dec 1, 2006
filing date -
Dec 30, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.
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