US Patent No: 7,554,806
Number of patents in Portfolio can not be more than 2000
Interface module-mounted LSI package
Stats
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Jun 30, 2009
Issued date -
Jul 19, 2007
filing date -
11/779,964
serial no -
In Force
status
Importance
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Abstract
An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,894,882 Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure | 28 | 1996 | |
| 2006/0037,741 Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body | 1 | 2004 | |
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| 2003/0081,389 Silicon interposer-based hybrid voltage regulator system for VLSI devices | 18 | 2001 | |
| 6,750,536 Current supply and support system for a thin package | 5 | 2001 | |
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| 6,256,201 Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe | 25 | 1999 | |
| 2004/0190,260 Heat sink with heat dissipating fins and method of manufacturing heat sink | 5 | 2004 | |
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| 6,861,750 Ball grid array package with multiple interposers | 62 | 2002 | |
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| 6,816,377 Electronic control unit | 16 | 2003 | |
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| 6,982,877 Heat sink having compliant interface to span multiple components | 12 | 2004 | |
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| 6,879,488 Radio frequency module | 7 | 2002 | |
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| 2002/0008,963 Inter-circuit encapsulated packaging | 18 | 2001 | |
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| 6,552,906 Radiator for electronic parts, electronic device, electric circuit device, and computer | 9 | 2001 | |
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| 6,351,382 Cooling method and device for notebook personal computer | 22 | 2000 | |
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| 6,172,416 Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same | 11 | 1998 | |
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| 2006/0268,527 Component mounting board structure and production method thereof | 6 | 2006 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Dec 30, 2012 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 30, 2016 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 30, 2020 |
| Fee | Large entity fee | small entity fee | micro entity fee |
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| Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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