Switches for shorting during MEMS etch release
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United States of America Patent
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Jul 7, 2009
Grant Date -
Jul 3, 2008
app pub date -
Dec 29, 2006
filing date -
Dec 29, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A MEMS (Microelectromechanical system) device is described. The device includes a first layer on a substrate, and a sacrificial layer on or over the first layer, the first sacrificial layer being configured to be removed in a removal procedure. The device also includes a second layer on or over the first sacrificial layer, where the second layer is spaced apart from the first layer, and a shorting element electrically connecting the first and second layers, where at least a portion of the shorting element is removable in the removal procedure.
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