Tape supported memory card leadframe structure
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United States of America Patent
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Jul 7, 2009
Grant Date -
N/A
app pub date -
Jun 21, 2006
filing date -
Apr 21, 2004
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape the bottom contact surfaces of the contacts, at least portions of the bottom dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the bottom contact surfaces are exposed in an exterior surface thereof.
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