Module comprising a semiconductor chip comprising a movable element
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United States of America Patent
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Jul 7, 2009
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N/A
app pub date -
Feb 21, 2007
filing date -
Feb 21, 2007
priority date (Note) -
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Abstract
The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips.
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