Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
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United States of America Patent
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Jul 14, 2009
Grant Date -
Jun 14, 2007
app pub date -
Feb 15, 2007
filing date -
Jul 1, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device, including a semiconductor chip having electrodes, a substrate having an interconnect pattern, and an adhesive, the adhesive having a first portion and a second portion, the first portion interposed between a surface of the substrate on which the interconnect pattern is formed and a surface of the semiconductor chip on which the electrodes are formed, the second portion not overlapping with the semiconductor chip. Further disclosed is the semiconductor device mounted on the circuit board and an electronic instrument having the semiconductor device.
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