Systems and methods for designing and fabricating multi-layer structures having thermal expansion properties
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United States of America Patent
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Jul 21, 2009
Grant Date -
Nov 16, 2006
app pub date -
Jul 11, 2006
filing date -
Apr 9, 2002
priority date (Note) -
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Abstract
Systems and methods for designing and fabricating multi-layer structures having thermal expansion properties are provided. One embodiment provides a multi-layer structure comprising a central layer, a first layer, and a second layer. The first layer is constrained to a first side of the central layer and has a first thickness. The first layer comprises a first material having a first value for a thermal expansion property. The second layer is constrained to a second side of the central layer and has a second thickness. The second layer comprises a second material having a second value for a thermal expansion property. The second thickness and the second value for the thermal expansion property and the first thickness and the first value for the thermal expansion property are such that, upon a change in temperature, the net change in the strain energy in the first layer and the net change in the strain energy in the second layer are substantially equal.
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