Molded ceramic surface mount package
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United States of America Patent
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-
Jul 21, 2009
Grant Date -
Dec 4, 2008
app pub date -
May 31, 2007
filing date -
May 31, 2007
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The surface mount package is assembled from a ceramic base which is imprinted on its upper and lower surfaces with conductive patterns for attachment of and connection to an electronic or electromechanical device, a molded dielectric layer for forming a cavity and a seal ring. The molded dielectric is formed by aligning a dielectric preform with the base, positioning the seal ring on top of the preform, then applying a mold over the layers to shape the dielectric during a firing process that fuses the base, preform and seal ring to create a hermetic seal. The preform is of sufficient thickness that the electronic device will be fully contained within the cavity when placed into the completed package.
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