Method for producing a laser diode component, housing for a laser diode component, and laser diode component itself
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United States of America Patent
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Jul 21, 2009
Grant Date -
May 22, 2008
app pub date -
May 26, 2004
filing date -
May 26, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A method for producing a laser diode component having an electrically insulating housing basic body and electrical connecting conductors, which are led out from the housing basic body and are accessible from outside the housing basic body. The housing basic body is produced from a material which is transmissive to a laser radiation emitted by the laser diode component. The housing basic body includes a chip mounting region. A beam axis of the laser diode component runs through the housing basic body. A housing that can be produced in this way and laser diode component having a housing of this type are also disclosed.
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