Wafer surface observation apparatus
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United States of America Patent
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Jul 21, 2009
Grant Date -
May 19, 2005
app pub date -
Nov 6, 2001
filing date -
Nov 6, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A dicing apparatus for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.
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