System and method for reducing temperature variation during burn in
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United States of America Patent
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Jul 21, 2009
Grant Date -
Nov 22, 2007
app pub date -
Jul 24, 2007
filing date -
Mar 1, 2004
priority date (Note) -
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Abstract
Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.
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