Method and apparatus for an improved upper electrode plate in a plasma processing system
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United States of America Patent
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Jul 28, 2009
Grant Date -
May 3, 2007
app pub date -
Dec 5, 2006
filing date -
Sep 30, 2002
priority date (Note) -
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Abstract
The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate.
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- H01J:ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- B05C:APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- H05B:ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE ....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
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