Method of determining adhesion quality
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United States of America Patent
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Jul 28, 2009
Grant Date -
Jan 3, 2008
app pub date -
Sep 13, 2007
filing date -
Jan 31, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.
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